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Intel Substrate Packaging Graduate Internship in Boston, Massachusetts

Job Description

Substrate Packaging Technology Development (SPTD) is looking for an intern, working in the Module Engineering for Packaging Research and Development, specifically to be a part of process and material development, 1274/1276/EMIB Client/Server product substrate technology development and to scale substrate packaging technology to enable further die disaggregation / heterogenous integration.

This position requires most of the time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of world-class advanced package substrates research and development packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Responsibilities will include but not be limited to:

  • Plan and conduct comprehensive DOEs to fundamentally characterize process windows and understand process/equipment/materials interactions.

  • Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity.

  • Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.

The ideal candidate should exhibit the following behavioral traits and/or skills:

  • Written and verbal communication and teamwork skills.

  • Work with ambiguity and flexibility with respect to job roles and working hours is required.

This is an internship for 6 months, 40 hours a week (full time).


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum qualifications:

  • Candidate must be pursuing an MS degree or a PhD degree in Materials Science and Engineering or Chemical Engineering or Organic Chemistry or Polymer Engineering or Mechanical Engineering or any other related engineering degree.

Preferred qualifications:

1+ years of experience any in the following:

  • Experience working with a variety of organic/inorganic materials and processes as well as characterizations utilizing techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM, etc. is highly desirable.

  • Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning.

  • Engineering troubleshooting and analytical skills on integrated technology issues and experience working with a broad team of other process and integration engineers.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Covid Statement

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.