Job Information
MIT Lincoln Laboratory Proj Technician (I.C.) in Lexington, Massachusetts
The Advanced Imager Technology Group develops imaging platforms that enable impactful national security capabilities and scientific discovery. From fundamental device research to developing camera technology for fielded systems, our group covers the full technology development spectrum from concept to prototype. Research areas include novel imager and detector design with in-house silicon and compound semiconductor fabrication facilities, leading-edge integrated circuit design, and advanced packaging and 3D integration capabilities. Examples of our technology include large-format focal planes, high-speed imagers, time-of-arrival detectors (LADAR receivers), and low-light-level imagers. The group's efforts span the range of device and materials development, integrated circuit design and fabrication, custom packaging, detector hybridization, and the development of control and readout electronics for system-level demonstrations.
Job Description
The Advanced Imager Technology group is seeking a project technician to support a wide variety of custom and unique microfabrication activities.
Responsibilities:
Process wafers through specialized fabrication steps in the Microelectronics Laboratory (ML) and/or Compound Semiconductor Laboratory and Microsystem Integration Facility (CSL-MIF). The primarily areas of responsibility will include wafer bonding, wet chemical processing (including chemical thinning, resist stripping, and wet cleaning), and device inspection. Other activities may include processing through hands-on custom fabrication steps, execution of design of experiments, continuous improvement and process development activities, process documentation, and training additional fabrication technicians.
Identify means to improve fabrication processes, such as increasing yield, simplifying or automating process flows, or improving data collection and Standard Operating Procedures (SOPs).
Compile and analyze metrology collected during wafer processing.
When applicable, support the needs of complementary activities in device packaging and testing.
Required Qualifications:
Graduation from a two-year day technical school or its equivalent or a minimum of ten years of applicable experience.
Broad understanding of silicon wafer processing and ability to function across multiple fabrication modules.
Excellent written and verbal communication skills.
Exceptional attention to detail, organization, and documentation.
Ability to follow written SOPs and document any excursions.
Ability to work on multiple tasks simultaneously.
Preferred Qualifications:
Previous experience in wafer bonding, wet chemical wafer thinning, or other key process components involved in back illumination of image sensors.
At MIT Lincoln Laboratory, our exceptional career opportunities include many outstanding benefits to help you stay healthy, feel supported, and enjoy a fulfilling work-life balance. Benefits offered to employees include: • Comprehensive health, dental, and vision plans • MIT-funded pension • Matching 401K • Paid leave (including vacation, sick, parental, military, etc.) • Tuition reimbursement and continuing education programs • Mentorship programs • A range of work-life balance options • ... and much more!
Please visit our Benefits page for more information. As an employee of MIT, you can also take advantage of other voluntary benefits, discounts, and perks. Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret-level DoD security clearance. MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.
Requisition ID: [[id]] #CJ